Semiconductor 3D Package Process Optimization and Failure Analysis
The VersaXRM-510 offers non-destructive submicron resolution tomographic capability, able to visualize buried features without de-packaging, cutting, or otherwise destroying the device, a process that can potentially introduce physical artifacts. This can also prevent the loss of critical information about the root cause of the failure as a result of destructive imaging methods.
Materials Science
Provides view into deeply buried microstructures that may be unobservable with 2D surface imaging such as optical microscopy, SEM, and AFM; offers a wide span of abilities, from visualizing cracks in soft composite materials to measuring porosity in steel. Unique ability to maintain resolution at a distance for in situ imaging experiments in real world environments, such as tensile/compression and temperature variation tests; delivers superior flexibility with support of sample sizes up to 300 mm.
Life Science Research
The versatility inherent on the platform, including industry-leading phase and absorption contrast, advances studies of soft and hard tissue, both stained and unstained, from microstructure to nanostructure, for applications such as quantification of osteocyte lacunar properties (volume, density, etc.) in bone morphology and investigation of unstained soft cartilage tissue.
Oil & Gas Exploration
The scout and zoom process begins with a quick survey scan (scout) to identify a volume of interest before a high resolution scan (zoom) is performed on the identified region, thus achieving highest resolution of detailed structure and pore connectivity within a representative region. The resulting 3D data set may be used for special core analysis (SCAL) simulations with a faster time to results (days or weeks vs. months or years) and improved quantification of detailed structure and pore connectivity across a wide range of magnifications and sample volumes.
